漆膜附著力測試
Film adhesion testing of thin films and stacks on substrates for material evaluation
3DIC TSV and BWS TTV硅片表面形貌測量
Film Stress薄膜應力量測儀
FEOL Electrical Characterization 電學特性
Thin wafer metrology 晶圓測量學
Film Adhesion漆膜附著力測試Film adhesion testing
of thin films and stacks on substrates
for material evaluation.
FSM offers two techniques suitable for low and medium adhesion strength tests.
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傳真：86-021-57656381
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